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Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
standard by SAE International, 09/22/2016
Description
This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.
Product Details
- Published:
- 09/22/2016
- File Size:
- 1 file , 610 KB
- Redline File Size:
- 2 files , 2.8 MB
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