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Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
standard by SAE International, 10/03/2011
Description
This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.
Product Details
- Published:
- 10/03/2011
- File Size:
- 1 file , 76 KB
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